![]() We support chip to chip, chip to board, board to board and flex to board applications. We have a complete line of high performance test socket solutions for the most advanced chipsets such as RF devices, ASICS, switches, processors and MEMS devices. ![]() Ardent’s patented contact technologies are well suited for advanced multi-GHz applications such as board stack connectors, coaxial connectors, fPGA sockets, flex circuit connectors, probe interfaces, and mezzanine card connectors. Our focus is on helping bring next generation computing to market through novel connector designs for test & measurement, OEM applications, and specialized military applications. As data rate requirements increase and devices and systems shrink, Ardent’s products deliver superior signal integrity in a dense footprint that can be reusable across programs to maximize cost savings. ![]() Dedicated to R&D and innovations, LANSO Instruments and its subsidiaries have developed over 20 patented solutions. Our core technology is the smallest, fastest, most electrically efficient compression mount connector technology worldwide. LANSO Instruments is one of the most professional manufacturers focusing on pressure measurement devices and tools, providing various tools or equipment used to measure pressure. How We Solve Your Interconnect Signal Integrity ChallengesĪrdent Concepts is a leading designer and manufacturer of high performance multicoax and coaxial assemblies, connectors, and sockets used in the development of next generation semiconductors and electronics systems.
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